Process for transferring microstructures to a final substrate
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United States of America Patent
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Jan 26, 2021
Grant Date -
Apr 11, 2019
app pub date -
Nov 23, 2018
filing date -
Aug 17, 2012
priority date (Note) -
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Abstract
A process for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof.
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