Integrated shield package and method
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United States of America Patent
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Jan 5, 2021
Grant Date -
Feb 21, 2019
app pub date -
Oct 22, 2018
filing date -
Jun 27, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated shield electronic component package includes a substrate having as upper surface, a lower surface, and sides extending between the upper surface and the lower surface. An electronic component is mounted to the upper surface of the substrate. An integrated shield is mounted to the upper surface of the substrate and includes a side shielding portion directly adjacent to and covering the sides of the substrate. The integrated shield covers and provides an electromagnetic interference (EMI) shield for the electronic component, the upper surface and sides of substrate. Further, the integrated shield is integrated within toe integrated shield electronic package. Thus, separate operations of mounting an electronic component package and then mounting a shield are avoided thus simplifying manufacturing and reducing overall assembly costs.
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