Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
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United States of America Patent
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Dec 29, 2020
Grant Date -
Mar 22, 2018
app pub date -
Dec 8, 2016
filing date -
Jun 30, 2016
priority date (Note) -
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Abstract
A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder.
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