Wet etch apparatus and method for using the same

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United States of America Patent

PATENT NO 10872788
APP PUB NO 20200168480A1
SERIAL NO

16542119

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Abstract

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A method includes dispensing a liquid etchant onto a wafer, wherein the wafer is free from rotation during dispensing the liquid etchant; blowing the liquid etchant on the wafer using a gas flow, wherein a direction of the gas flow remains substantially constant during dispensing the liquid etchant; and turning the gas flow off after a target structure on the wafer is etched away by the liquid etchant.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Han-Wen Taichung, TW 21 33
Lu, Hong-Ting Taichung, TW 4 0

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