Aluminum-copper connector having a heterostructure, and method for producing the heterostructure
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United States of America Patent
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Dec 22, 2020
Grant Date -
Aug 29, 2019
app pub date -
Jun 3, 2017
filing date -
Jul 25, 2016
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Abstract
A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.
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