Adhesive film for semiconductor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10865329
APP PUB NO 20170233610A1
SERIAL NO

15500355

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Abstract

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The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTD128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336 07336

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jo, Jung Ho Daejeon, KR 54 137
Kim, Hee Jung Daejeon, KR 45 451
Kim, Jung Hak Daejeon, KR 63 278
Kim, Se Ra Daejeon, KR 39 212
Kim, Young Kook Daejeon, KR 41 152
Lee, Kwang Joo Daejeon, KR 52 74
Nam, Seung Hee Daejeon, KR 72 530

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