Substrate package having variable marking
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 8, 2020
Grant Date -
May 21, 2020
app pub date -
Jan 23, 2020
filing date -
Sep 28, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are a substrate package, a method of fabricating the substrate package, and a system including the substrate package. The substrate package includes a stack of substrate sheets in an individual form, a continuous form, or a roll form. The stack has a sidewall defined by edges of the substrate sheets and a mark on the sidewall includes mark segments on respective edges. The mark segments vary such that one or more of the mark segments have a respective segment characteristic, such as a length. The segment characteristic can encode information about an attribute of the substrate sheet, such as a physical characteristic of the sheet.
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