Method of manufacture of a structure and structure
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United States of America Patent
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Nov 24, 2020
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app pub date -
May 20, 2020
filing date -
May 20, 2020
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Abstract
A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.
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