Test coupons having node bonds, methods for testing node bonds, and related apparatuses
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United States of America Patent
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Nov 24, 2020
Grant Date -
Aug 23, 2018
app pub date -
Feb 22, 2017
filing date -
Feb 22, 2017
priority date (Note) -
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Abstract
A test coupon having node bonds is disclosed. In some aspects, the method includes a first foil and a second foil, stripes of adhesive serially disposed across a width of the first foil or the second foil and coupling the first foil and second foil to one another to form node bonds, and a first adherend coupled to the first foil and a second adherend coupled to the second foil such that the first foil and the second foil are provided between the first adherend and the second adherend, the first adherend and the second adherend being connectable to load blocks of a test apparatus capable of loading the test coupon to determine characteristics of each of the node bonds formed from the stripes of adhesive. A method for testing node bonds and a related apparatus are also disclosed.
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