Base material for printed circuit board and printed circuit board
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United States of America Patent
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Nov 17, 2020
Grant Date -
N/A
app pub date -
Jul 9, 2018
filing date -
Oct 16, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.
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