Electronics package with improved thermal performance
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United States of America Patent
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Nov 17, 2020
Grant Date -
Aug 15, 2019
app pub date -
Apr 24, 2019
filing date -
Mar 30, 2016
priority date (Note) -
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Abstract
An electronics package includes a thermal lid over a flip chip component such that the thermal lid is in contact with a surface of a flip chip component and one or more thermal vias in a substrate on which the flip chip component is mounted. The thermal lid dissipates heat from the flip chip component by way of the thermal vias to improve the thermal performance of the electronics package.
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