Plasma spreading apparatus and method of spreading plasma in process ovens

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10840068
APP PUB NO 20180308668A1
SERIAL NO

15898178

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Abstract

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A device and method of spreading plasma which allows for plasma etching over a larger range of process chamber pressures. A plasma source, such as a linear inductive plasma source, may be choked to alter back pressure within the plasma source. The plasma may then be spread around a deflecting disc which spreads the plasma under a dome which then allows for very even plasma etch rates across the surface of a substrate. The apparatus may include a linear inductive plasma source above a plasma spreading portion which spreads plasma across a horizontally configured wafer or other substrate. The substrate support may include heating elements adapted to enhance the etching.

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Patent Owner(s)

  • YIELD ENGINEERING SYSTEMS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McCoy, Craig Walter San Jose, US 11 9
Moffat, William San Jose, US 15 42

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