Wiring board
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United States of America Patent
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Nov 10, 2020
Grant Date -
N/A
app pub date -
Sep 27, 2019
filing date -
Nov 5, 2018
priority date (Note) -
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Abstract
A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
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