Wiring board
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United States of America Patent
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Nov 10, 2020
Grant Date -
N/A
app pub date -
Jul 26, 2019
filing date -
Aug 29, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.
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