Image sensor with stacked structures
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United States of America Patent
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Nov 10, 2020
Grant Date -
Apr 2, 2020
app pub date -
Jun 10, 2019
filing date -
Oct 2, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is an image sensor, which includes: a first substrate; a first structure on a front surface of the first substrate, the first structure including a first interlayer insulating layer surrounding a first conductive layer; a second substrate; a second structure on a front surface of the second substrate facing the front surface of the first substrate, the second structure including a second interlayer insulating layer, the second interlayer insulating layer being bonded to the first interlayer insulating layer; an organic photoelectric layer on a back surface of the second substrate; and a via electrode structure in contact with the first conductive layer through the second substrate and the second structure, the via electrode structure including an air gap therein.
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