Method of making an encapsulated filtered feedthrough for an implantable medical device
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United States of America Patent
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Nov 10, 2020
Grant Date -
Jul 26, 2018
app pub date -
Mar 23, 2018
filing date -
Mar 31, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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