Gradient micro-electro-mechanical systems (MEMS) microphone with varying height assemblies
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United States of America Patent
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Nov 3, 2020
Grant Date -
Aug 30, 2018
app pub date -
Apr 23, 2018
filing date -
Jul 3, 2014
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Abstract
In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly comprises an enclosure, a single micro-electro-mechanical systems (MEMS) transducer, a substrate layer, and an application housing. The single MEMS transducer is positioned within the enclosure. The substrate layer supports the single MEMS transducer. The application housing supports the substrate layer and defining at least a portion of a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and at least a portion of a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
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