Methods of fabricating silicon-on-insulator (SOI) semiconductor devices using blanket fusion bonding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10825719
APP PUB NO 20190237358A1
SERIAL NO

16378114

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
KULITE SEMICONDUCTOR PRODUCTS INCLEONIA NJ

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ned, Alexander A Kinnelon, US 81 1220
Stefanescu, Sorin New Milford, US 15 20
VanDeWeert, Joseph R Maywood, US 32 106

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 May 3, 2028
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 3, 2032
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00