Wafer centering device for measurement apparatus
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United States of America Patent
Stats
-
Oct 27, 2020
Grant Date -
Sep 13, 2018
app pub date -
Sep 1, 2016
filing date -
Sep 11, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention provides a wafer centering device for a measurement apparatus, the device comprising: a body unit; a guide unit which is installed in the body unit, has a support part for supporting a wafer, and has a through-hole and; and a displacement unit which is formed to be moved in the through-hole and has a pusher for moving the wafer on the support part.
First Claim
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International Classification(s)
- 2016 Application Filing Year
- B23Q Class
- 644 Applications Filed
- 459 Patents Issued To-Date
- 71.28 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B23Q Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 27, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 27, 2032 |
