Soldering apparatus and method for manufacturing electronic unit
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United States of America Patent
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Oct 27, 2020
Grant Date -
May 10, 2018
app pub date -
Oct 27, 2017
filing date -
Nov 8, 2016
priority date (Note) -
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Abstract
A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.
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