Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate
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United States of America Patent
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Oct 20, 2020
Grant Date -
Oct 18, 2018
app pub date -
Jun 19, 2018
filing date -
Jan 7, 2016
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Abstract
A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.
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