Semiconductor package structure
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United States of America Patent
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Oct 20, 2020
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N/A
app pub date -
Aug 2, 2019
filing date -
Aug 2, 2019
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Abstract
A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
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