Phase change memory and method of fabricating the same

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United States of America Patent

PATENT NO 10811607
SERIAL NO

16423184

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Abstract

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A phase change memory and a method of fabricating the same are provided. The phase change memory includes a lower electrode, an annular heater, an annular phase change layer, and an upper electrode. The annular heater is disposed over the lower electrode. The annular phase change layer is disposed over the annular heater, and the annular phase change layer and the annular heater are misaligned in a normal direction of the lower electrode. The upper electrode is disposed over the annular phase change layer. The present disclosure simplifies the manufacturing process of the phase change memory, reduces the manufacturing cost, and improves the manufacturing yield. In addition, a contact surface between the heater and the phase change layer of the phase change memory of the present disclosure is very small, so that the phase change memory has an extremely low reset current.

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Patent Owner(s)

Patent OwnerAddress
JIANGSU ADVANCED MEMORY TECHNOLOGY CO LTDNO 601 EAST CHANGJIANG ROAD HUAIYIN DISTRICT HUAI'AN JIANGSU 223300
JIANGSU ADVANCED MEMORY SEMICONDUCTOR CO LTDNO 601 EAST CHANGJIANG ROAD HUAIYIN DISTRICT HUAI'AN JIANGSU 223300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ming-Feng Hsinchu County, TW 11 44
Cheng, Sheng-Hung Hsinchu County, TW 6 38
Yang, Tzu-Hao Hsinchu County, TW 3 2

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