Photosensitive resin composition for relief printing original plate and relief printing original plate obtained therefrom
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United States of America Patent
Stats
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Oct 20, 2020
Grant Date -
Aug 23, 2018
app pub date -
Aug 2, 2016
filing date -
Sep 28, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a photosensitive resin composition for a relief printing original plate which can achieve both of a printing reproducibility of gradation of a highlight part and a printing durability, and can further achieve a low plate surface tackiness. A photosensitive resin composition for a relief printing original plate containing water-soluble or water-dispersible polyamide, a photopolymerizable unsaturated compound and a photopolymerization initiator as essential ingredients, characterized in that a total of a content of an alicyclic structural unit obtained from diamine and a content of an alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 30 to 90 molar %, and the content of the alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 20 molar % or more.
First Claim
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International Classification(s)
- 2016 Application Filing Year
- B41N Class
- 72 Applications Filed
- 48 Patents Issued To-Date
- 66.67 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B41N Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 20, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 20, 2032 |
