Substrate heating apparatus, substrate heating method and method of manufacturing electronic device
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United States of America Patent
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Oct 13, 2020
Grant Date -
Jul 26, 2018
app pub date -
Dec 13, 2017
filing date -
Jan 23, 2017
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Abstract
To provide a substrate heating apparatus, a substrate heating method and a method of manufacturing an electronic device having excellent uniformity at the time of processing the substrate by a linear heat source. A substrate heating apparatus including a substrate holding tool holding a substrate as a processed object, a heat source heating the substrate held by the substrate holding tool by a linear heating portion, a moving mechanism allowing the substrate holding tool and the heat source to relatively move in a direction orthogonal to a longitudinal direction of the linear heating portion of the heat source and a cooling mechanism arranged in the substrate holding tool and contacting the substrate to cool an outer peripheral portion of the substrate, in which the cooling mechanism has a distribution in cooling ability according to a position of the substrate.
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