Adhesive composition, adhesive film, and bonding method
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United States of America Patent
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Oct 6, 2020
Grant Date -
Jan 24, 2019
app pub date -
Sep 25, 2018
filing date -
Apr 13, 2012
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Abstract
An adhesive composition contains (a) a resin consisting of (i) a block copolymer or (ii) 35% by weight or greater and less than 100% of the block copolymer and 65% by weight or less of a random copolymer, the block copolymer having a weight average molecular weight in a range of 50,000 to 150,000, wherein the block copolymer is a diblock copolymer, a triblock copolymer, or a combination thereof, and includes a styrene group, both terminals of a main chain of the triblock copolymer are styrene groups; (b) a solvent which includes a condensed polycyclic hydrocarbon, wherein an adhesive layer formed by using the adhesive composition has a Young's modulus of 0.1 GPa or greater at 23° C., a storage modulus (G′) of 1.5×105 Pa or less at 220° C., and a loss factor (tan σ) of 1.3 or less at 220° C.; and (c) a thermal polymerization inhibitor.
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