Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same

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United States of America Patent

PATENT NO 10793711
APP PUB NO 20190292363A1
SERIAL NO

16301509

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Abstract

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The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG SDI CO LTDYONGIN-SI GYEONGGI-DO 17084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eom, Tae Shin Suwon-si, KR 5 5
Im, Su Mi Suwon-si, KR 9 48
Kim, Jae Hyun Suwon-si, KR 259 2059
Lee, Eun Jung Suwon-si, KR 178 412
Lee, Yoon Man Suwon-si, KR 3 1

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