Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
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United States of America Patent
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Sep 22, 2020
Grant Date -
Aug 22, 2019
app pub date -
Nov 1, 2018
filing date -
Feb 20, 2018
priority date (Note) -
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Abstract
A semiconductor package includes a package substrate, at least one first semiconductor chip on the package substrate and having a first height as measured from the package substrate, at least one second semiconductor chip on the package substrate spaced apart from the first semiconductor chip and having a second height less than the first height as measured from the package substrate, at least one third semiconductor chip stacked on the first and second semiconductor chips, and at least one support structure between the at least one second semiconductor chip and the at least one third semiconductor chip configured to support the at least one third semiconductor chip.
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