Wafer composite and method for producing a semiconductor component

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United States of America Patent

PATENT NO 10784145
APP PUB NO 20190244853A1
SERIAL NO

16264071

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Abstract

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A wafer composite is provided which includes an auxiliary substrate, a donor substrate and a sacrificial layer formed between the auxiliary substrate and the donor substrate. Functional elements of the semiconductor component are formed in a component layer, including at least one partial layer of the donor substrate. The auxiliary substrate is then separated from the component layer by heat input into the sacrificial layer.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGAM CAMPEON 1-15 NEUBIBERG 85579

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berger, Rudolf Regensburg, DE 85 942
Lehnert, Wolfgang Lintach, DE 51 286
Metzger-Brueckl, Gerhard Geisenfeld, DE 16 144
Ruhl, Guenther Regensburg, DE 65 796
Rupp, Roland Lauf, DE 190 1751

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