Memory cells, memory systems, and memory programming methods

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United States of America Patent

PATENT NO 10783961
APP PUB NO 20190311767A1
SERIAL NO

16437997

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Abstract

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Memory cells, memory systems and methods are described. In one embodiment, a memory cell includes electrodes and a memory element, and a first electrically conductive structure is formed within dielectric material providing the memory element in a low resistance state as a result of a first voltage of a first polarity being applied across the electrodes. Additionally, the first electrically conductive structure is removed from the dielectric material providing the memory element in a high resistance state as a result of a second voltage of a second polarity, which is opposite to the first polarity, being applied across the electrodes. A permanent and irreversible electrically conductive structure is formed within the dielectric material providing the memory element in the low resistance state as a result of a third voltage of the second polarity and having an increased potential compared with the second voltage being applied across the electrodes.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INCBOISE ID

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitagawa, Makoto Boise, US 135 2222
Kunihiro, Takafumi Boise, US 22 261
Otsuka, Wataru Boise, US 28 474
Ramaswamy, D V Nirmal Boise, US 93 754
Sumino, Jun Boise, US 49 606
Tsushima, Tomohito Boise, US 47 782

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