Beamforming integrated circuit with RF grounded material ring
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United States of America Patent
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Sep 15, 2020
Grant Date -
Apr 26, 2018
app pub date -
Oct 24, 2017
filing date -
Oct 24, 2016
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Abstract
A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.
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