Gradient micro-electro-mechanical systems (MEMS) microphone
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United States of America Patent
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Sep 8, 2020
Grant Date -
Apr 11, 2019
app pub date -
Dec 10, 2018
filing date -
Jul 3, 2013
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Abstract
In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
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