Stage and substrate processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10763764
APP PUB NO 20180138835A1
SERIAL NO

15815447

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A stage includes a heat exchanger, a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction, and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface. The heat exchanger includes a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes and a plurality of second tubes communicating with the through-holes.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiroki, Tsutomu Yamanashi, JP 60 2279

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