Etching apparatus and etching method

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United States of America Patent

PATENT NO 10763126
APP PUB NO 20190333739A1
SERIAL NO

16393261

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Abstract

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An etching apparatus includes: a placement table serving as a lower electrode and configured to place a workpiece to be subjected to an etching processing thereon; a DC power supply configured to generate a negative DC voltage applied to the placement table; and a controller configured to: periodically apply a negative DC voltage to the placement table from the DC power supply when the etching processing on the workpiece placed on the placement table is initiated, and decrease a frequency of the negative DC voltage applied to the placement table with an elapse of processing time of the etching processing.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagami, Koichi Miyagi, JP 50 910
Nagaseki, Kazuya Miyagi, JP 96 3054

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