Method for three-dimensionally shaping resin packaging member, and resin packaging member

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United States of America Patent

PATENT NO 10759134
APP PUB NO 20180370174A1
SERIAL NO

16064119

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Abstract

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A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.

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Patent Owner(s)

Patent OwnerAddress
TOYO SEIKAN CO LTDJAPAN'S TOKYO GOTANDA SHINAGAWA EAST 2 CHOME 18 NO 1 TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatano, Yasushi Tokyo, JP 30 236
Kuriyama, Kouji Yokohama, JP 5 12
Yamaguchi, Madoka Yokohama, JP 5 34
Yasuumi, Takahiro Yokohama, JP 11 3

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