Method and apparatus for strain relieving surface mount attached connectors
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United States of America Patent
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Aug 18, 2020
Grant Date -
Sep 12, 2019
app pub date -
May 28, 2019
filing date -
Dec 1, 2015
priority date (Note) -
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Abstract
An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.
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