Multi-chip module (MCM) with chip-to-chip connection redundancy and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 18, 2020
Grant Date -
N/A
app pub date -
Oct 25, 2019
filing date -
Oct 25, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a multi-chip module (MCM) with redundant chip-to-chip communication connection(s) to minimize the need to discard a chip-mounting layer due to defective signal traces. The MCM includes at least first and second chips mounted on the chip-mounting layer. The chip-mounting layer includes signal traces that are electrically connected between first and second links on the first and second chips, respectively, to form communication connections including at least one redundant communication connection. Instead of being directly connected to the chip-to-chip communication connections, first and second interfaces on the first and second chips are connected via first and second multiplexors, respectively, to selected ones of multiple chip-to-chip communication connections. By employing the multiplexors and the redundant chip-to-chip communication connection(s), chip-to-chip communication connection(s) with defective signal trace(s) can be bypassed. Specifically, during MCM assembly, the multiplexors are programmed to avoid using chip-to-chip communication connections with defective signal traces.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully