Chip bonding apparatus and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10748800
APP PUB NO 20190088516A1
SERIAL NO

16080376

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD201203 NO 1525 EAST CHEUNG ROAD SHANGHAI PUDONG NEW AREA SHANGHAI CITY SHANGHAI CITY 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Feibiao Shanghai, CN 13 17
Ge, Yaping Shanghai, CN 3 7
Guo, Song Shanghai, CN 63 155
Xia, Hai Shanghai, CN 12 29
Yu, Bin Shanghai, CN 738 19031
Zhu, Yuebin Shanghai, CN 7 12

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