Touch input device having connection member electrically connecting sensor electrode and printed circuit board by contact and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 4, 2020
Grant Date -
Jun 27, 2019
app pub date -
Dec 7, 2018
filing date -
Dec 27, 2017
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
A touch input device including a connection member electrically connecting a sensor electrode and a printed circuit board by contact without soldering may include a base including a metal complex, an electrode groove formed by irradiating a laser on the base, a sensor electrode formed on the electrode groove through a plating or deposition process and including a conductive material, a sensor IC to sense a change in capacitance of the sensor electrode, a printed circuit board on which the sensor IC is mounted and is disposed to be coupled with the base, and the connection member provided on the printed circuit board and configured to electrically connect the sensor electrode and the printed circuit board, wherein the connection member may elastically come into contact with the sensor electrode to connect the sensor electrode and the printed circuit board.
First Claim
all claims..Other Claims data not available
Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
---|---|---|---|---|---|
KR | B1 | KR102502803 | Dec 27, 2017 | Patent | Grant |
Type : Patent Sub-Type : Grant | |||||
PATENT SPECIFICATION | 터치 입력장치 및 이를 제조하는 제조방법 | Feb 23, 2023 |
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KIA MOTORS CORPORATION | 12 HEOLLEUNG-RO SEOCHO-GU SEOUL 06797 | |
HYUNDAI MOTOR COMPANY | 12 HEOLLEUNG-RO SEOCHO-GU SEOUL 06797 06797 | |
SEOYON ELECTRONICS CO LTD | 424 SHINWONRO DANWON-GU ANSAN-SI GYEONGGI-DO |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Choi, Jun Sam | Anyang-si, KR | 5 | 16 |
# of filed Patents : 5 Total Citations : 16 | |||
Joo, Sihyun | Seoul, KR | 33 | 142 |
# of filed Patents : 33 Total Citations : 142 | |||
Kang, Nae Seung | Siheung-si, KR | 7 | 63 |
# of filed Patents : 7 Total Citations : 63 | |||
Min, Jungsang | Seoul, KR | 36 | 153 |
# of filed Patents : 36 Total Citations : 153 | |||
Oh, Jongmin | Suwon-si, KR | 19 | 58 |
# of filed Patents : 19 Total Citations : 58 | |||
Park, Sam Min | Incheon, KR | 4 | 15 |
# of filed Patents : 4 Total Citations : 15 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- G06F Class
- 0 % this patent is cited more than
- 5 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 4, 2028 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 4, 2032 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Dec 27, 2023 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Aug 04, 2020 | P | Publication | |
Jul 15, 2020 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jun 24, 2020 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
Apr 20, 2020 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
Dec 17, 2019 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Jun 27, 2019 | P | Published | |
Jan 16, 2019 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
Dec 07, 2018 | F | Filing | |
Dec 07, 2018 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JOO, SIHYUN;KANG, NAE SEUNG;MIN, JUNGSANG;AND OTHERS;SIGNING DATES FROM 20181203 TO 20181204;REEL/FRAME:047707/0694 Owner name: KIA MOTORS CORPORATION, KOREA, REPUBLIC OF free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JOO, SIHYUN;KANG, NAE SEUNG;MIN, JUNGSANG;AND OTHERS;SIGNING DATES FROM 20181203 TO 20181204;REEL/FRAME:047707/0694 Owner name: SEOYON ELECTRONICS CO., LTD., KOREA, REPUBLIC OF free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JOO, SIHYUN;KANG, NAE SEUNG;MIN, JUNGSANG;AND OTHERS;SIGNING DATES FROM 20181203 TO 20181204;REEL/FRAME:047707/0694 Owner name: HYUNDAI MOTOR COMPANY, KOREA, REPUBLIC OF |
Dec 07, 2018 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Dec 27, 2017 | PD | Priority Date |

Matter Detail

Renewals Detail
