Wiring substrate for electronic component inspection apparatus
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United States of America Patent
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Jul 28, 2020
Grant Date -
Mar 14, 2019
app pub date -
Sep 10, 2018
filing date -
Sep 12, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
[Objective] To provide a wiring substrate for electronic component inspection apparatus which includes a first laminate of resin layers with a plurality of pads for probe provided on its front surface and a second laminate of ceramic layers disposed on the back side of the first laminate and which, despite joining by brazing of a plurality of studs to the back surface of the second laminate, is free from deformation of resin of the first laminate caused by softening or the like and from accidental formation of a short circuit between brazing material layers used for the brazing and external connection terminals formed on the back surface of the second laminate.
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