Conductive adhesive

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United States of America Patent

PATENT NO 10723920
SERIAL NO

16484718

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Abstract

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A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.

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Patent Owner(s)

Patent OwnerAddress
TATSUTA ELECTRIC WIRE & CABLE CO LTD3-1 IWATA-CHO 2-CHOME HIGASHIOSAKA-SHI OSAKA 5788585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyagi, Yoshihiko Kizugawa, JP 8 13
Isobe, Osamu Kizugawa, JP 13 74
Kamino, Kenji Kizugawa, JP 12 67

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