Method of transferring thin film
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United States of America Patent
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Jul 28, 2020
Grant Date -
Mar 27, 2014
app pub date -
May 23, 2012
filing date -
May 23, 2011
priority date (Note) -
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Abstract
The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
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