Method for producing a flat free contacting surface for semiconductor nanostructures
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United States of America Patent
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Jul 14, 2020
Grant Date -
Dec 20, 2018
app pub date -
Oct 22, 2016
filing date -
Dec 2, 2015
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Abstract
A method for producing a planar free surface comprising embedded, contactable nanostructures includes arranging at least one nanostructure on a surface of an initial substrate; applying a first layer to the surface of the initial substrate, wherein the first layer embeds the at least one nanostructure; applying a target substrate to the first layer; and separating the initial substrate from the first layer such that the at least one nanostructure embedded in the first layer has a planar free surface. An additional layer is applied to the surface of the initial substrate before the at least one nanostructure is applied to the initial substrate, and in that the initial substrate is removed from the first layer using a solvent.
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