Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil

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United States of America Patent

PATENT NO 10706985
APP PUB NO 20160358684A1
SERIAL NO

15109760

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Abstract

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An aluminum foil having a high adhesiveness to solder and containing at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

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Patent Owner(s)

Patent OwnerAddress
TOYO ALUMINIUM KABUSHIKI KAISHA6-8 KYUTARO-MACHI 3-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0056

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Sotaro Osaka, JP 3 0
Nishio, Yoshitaka Osaka, JP 78 1182

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