Polishing pad and polishing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10702970
APP PUB NO 20180193974A1
SERIAL NO

15863552

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Calculated Rating
US Family Size
Non-US Coverage

Abstract

See full text

The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

First Claim

See full text

Other Claims data not available

Family

PCTEP
+

Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTDKAOHSIUNG CITY

International Classification(s)

loading....
  • 2018 Application Filing Year
  • B24B Class
  • 755 Applications Filed
  • 524 Patents Issued To-Date
  • 69.41 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Liu, Wei-Te Kaohsiung, TW 10 28
Wang, Lyang-Gung Kaohsiung, TW 21 42
Wu, Wen-Chieh Kaohsiung, TW 53 137
Yao, I-Peng Kaohsiung, TW 79 189

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 0 Citation Count
  • B24B Class
  • 0 % this patent is cited more than
  • 5 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges5063584101 - 1011 - 2021 - 300255075100125150175200225250275300325350375400425450475500525550

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jan 7, 2028
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 7, 2032