Electronic device including waterproof structure
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United States of America Patent
Stats
-
Jun 30, 2020
Grant Date -
Mar 7, 2019
app pub date -
Aug 29, 2018
filing date -
Sep 5, 2017
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SAMSUNG ELECTRONICS CO LTD | 129 SAMSUNG-RO YEONGTONG-GU GYEONGGI-DO SUWON-SI 16677 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ahn, Jae-Uk | Incheon, KR | 1 | 15 |
Lee, Wook-Jin | Suwon-si, KR | 4 | 58 |
Park, Sung-Eun | Gyeonggi-do, KR | 87 | 1577 |
Wee, Jong-Chun | Gyeonggi-do, KR | 1 | 15 |
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