Manufacturing method of three-dimensional heat conducting structure
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United States of America Patent
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Jun 30, 2020
Grant Date -
Dec 13, 2018
app pub date -
Aug 21, 2018
filing date -
May 25, 2015
priority date (Note) -
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Abstract
A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.
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