Integrated antenna on interposer substrate
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United States of America Patent
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Jun 23, 2020
Grant Date -
Apr 11, 2019
app pub date -
Dec 5, 2018
filing date -
Feb 27, 2013
priority date (Note) -
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Abstract
The present disclosure, in some embodiments, relates to an integrated antenna structure. The structure includes an excitable element and a first ground plane. The first ground plane is disposed between a first surface of a semiconductor substrate and the excitable element. A first line that is normal to the first surface of the semiconductor substrate extends through both the first ground plane and the excitable element. A second ground plane is separated from the first ground plane by the semiconductor substrate. The second ground plane is electrically coupled to the first ground plane.
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