Gallium liquid metal embrittlement for device rework
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United States of America Patent
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Jun 9, 2020
Grant Date -
Aug 16, 2018
app pub date -
Nov 20, 2017
filing date -
Feb 14, 2017
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Abstract
A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.
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