COMPOSITION FOR TUNGSTEN CMP
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United States of America Patent
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Jun 9, 2020
Grant Date -
Jul 2, 2020
app pub date -
Dec 31, 2018
filing date -
Dec 31, 2018
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Abstract
A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino acid compound having an isoelectric point of greater than 7. The pH of the composition is in a range from about 1 to about 5. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.
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